Code

SG500

Sub Group

None

Feature

Feature 1

Thermally conductive

Feature 2

Low volitility

Feature 3

Good dielectric properties

Feature 4

Low bleed at elevated temperatures

Old Code

6023

Appearance

White paste

Test Conditions

At 23+/-2°C

Colour

White

SG

2.3

Min Working Temp - °C

-50 °C

Max Working Temp +°C

150 °C

Shelf life

24 mths

Max storage temperature °C

40 °C

Pack Type

1-Part

Rheology

Paste

Cure Type

N/A

Thermal Conductivity W/mK

0.77 W/mK

Volume Resistivity ohms cm

1.1E+15 ohms cm

Dielectric Strength kV/mm

10.92 kV/mm

Dielectric Constant @ 1kHz

4.3

Dissipation Factor @ 1kHz

0.003

Water Potable

No

Silicone Yes/No

Yes

Weight Loss %

0.2 %

Bleed %

0.2 %

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