- Code
- SG500
- Sub Group
- None Feature
- Feature 1
- Thermally conductive
- Feature 2
- Low volitility
- Feature 3
- Good dielectric properties
- Feature 4
- Low bleed at elevated temperatures
- Old Code
- 6023
- Appearance
- White paste
- Test Conditions
- At 23+/-2°C
- Colour
- White
- SG
- 2.3
- Min Working Temp - °C
- -50 °C
- Max Working Temp +°C
- 150 °C
- Shelf life
- 24 mths
- Max storage temperature °C
- 40 °C
- Pack Type
- 1-Part
- Rheology
- Paste
- Cure Type
- N/A
- Thermal Conductivity W/mK
- 0.77 W/mK
- Volume Resistivity ohms cm
- 1.1E+15 ohms cm
- Dielectric Strength kV/mm
- 10.92 kV/mm
- Dielectric Constant @ 1kHz
- 4.3
- Dissipation Factor @ 1kHz
- 0.003
- Water Potable
- No
- Silicone Yes/No
- Yes
- Weight Loss %
- 0.2 %
- Bleed %
- 0.2 %