- Code
- QSil553
- Sub Group
- None Feature
- Feature 1
- Thermally conductive
- Feature 2
- UL94 V0 Approved file No. E205830
- Feature 3
- Low modulus
- Feature 4
- 1:1 Mix Ratio
- Old Code
- QSil553
- Appearance
- Viscous Liquid
- Test Conditions
- After 15 minutes at 150°C
- Colour
- Grey
- Colour A Part
- Beige
- Colour B Part
- Black
- SG
- 1.63
- SG A Part
- 1.63
- SG B Part
- 1.63
- Min Working Temp - °C
- -55 °C
- Max Working Temp +°C
- 260 °C
- FDA
- No
- Shelf life
- 24 mths
- Max storage temperature °C
- 30 °C
- Pack Type
- 2-Part Kit
- Mix Ratio
- 1:1
- Rheology
- Liquid
- Viscosity A-Part mPas
- 6000 mPas
- Viscosity B-Part mPas
- 6000 mPas
- Viscosity Mixed mPas
- 6000 mPas
- Non Corrosive
- Yes
- Cure Type
- Addition
- RTV or Heat cure
- Heat Acclerated RTV
- Self Bonding
- No
- UL 94V-0
- Yes
- Duro Shore A
- 45
- Tensile MPa
- 1.72 MPa
- Elongation %
- 240 %
- Tear kN/m
- 7.8 kN/m
- Modulus @ 100% Strain MPa
- 1.24 MPa
- CTE Volumetric ppm/°C
- 650 ppm/°C
- CTE Linear ppm/°C
- 217 ppm/°C
- Max Cure Hrs @ 25 °C
- 24 hrs
- Max Cure Mins @ 100 °C
- 7 mins
- Thermal Conductivity W/mK
- 0.68 W/mK
- Volume Resistivity ohms cm
- 4.02E+14 ohms cm
- Dielectric Strength kV/mm
- >18 kV/mm
- Dielectric Constant @ 1kHz
- 3.08
- Dissipation Factor @ 1kHz
- 0.009
- Pot Life mins
- 100 mins