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QSil 556


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TDS
SDS
Description
Addition Cure Potting Material
Feature
  • No solvent added
  • Long gel time
  • Low modulus / good elongation
  • Repairable
Code
QSil 556
Feature
Feature 1
No solvent added
Feature 2
Long gel time
Feature 3
Low modulus / good elongation
Feature 4
Repairable
Color
Gray
Color A
Beige
Color B
Black
Cure Type
Addition
Dielectric Constant
3.36
Dissipation Factor
0.002
Elongation at Break
90 %
Gel Time at 25°C/77°F
72 min
Hardness Shore A
50
Max Storage Temperature
38 °C
Max Working Temp
204 °C
Min Working Temp
-55 °C
Mix Ratio By Weight
1:1
Rheology
Liquid
RTV or Heat cure
RTV
Shelf Life
24 mths
Solids Content (%)
100 %
Specific Gravity A
1.31
Specific Gravity B
1.30
Tensile Strength
1.72 N/mm2
Test Conditions
Cured 15 minutes at 150C and tested at room temperature.
Thermal Conductivity
~0.37 W/mK
UL 94V-0
3.0 mm
UL File No.
E205830
UL Listed
yes
Viscosity A
1,050 cP
Viscosity B
2,200 cP
Viscosity Mixed
1,600 cP
Volume Resistivity (Ohms cm)
1.87E+15 ohms cm
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