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QSil 545


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TDS
SDS
Description
Addition Cure Potting Material
Feature
  • No Solvent Added
  • Fast Gel Time
  • Good elongation / Low modulus
  • Repairable
Code
QSil 545
Feature
Feature 1
No Solvent Added
Feature 2
Fast Gel Time
Feature 3
Good elongation / Low modulus
Feature 4
Repairable
Color
Gray
Color A
Beige
Color B
Black
Cure Type
Addition
Dielectric Constant
3.12
Dissipation Factor
0.003
Elongation at Break
101 %
Gel Time at 25°C/77°F
4.5
Hardness Shore A
62
Max Storage Temperature
38 °C
Max Working Temp
204 °C
Min Working Temp
-55 °C
Mix Ratio By Weight
1:1
RTV or Heat cure
RTV
Shelf Life
24 mths
Solids Content (%)
100 %
Specific Gravity A
1.40
Specific Gravity B
1.40
Tear Resistance (N/mm)
3.5 N/mm
Tensile Strength
4.53 N/mm2
Test Conditions
Cured 7 min at 150C and tested at room temp
Thermal Conductivity
~0.37 W/mK
UL 94V-0
3.0 mm
UL File No.
E205830
UL Listed
yes
Viscosity A
3,190 cP
Viscosity B
4,040 cP
Viscosity Mixed
3,600 cP
Volume Resistivity (Ohms cm)
1.47 E+15 ohms cm
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