- Code
- AS1500 Feature
- Feature 1
- Fast curing at room temperature
- Feature 2
- Flexible from -60°C/140°F to +300°C/572°F
- Feature 3
- Excellent adhesion to many substrates
- Feature 4
- Non slumping paste
- 100% Modulus (N/mm2)
- 1 MPa
- Appearance
- Thixotropic paste
- Color
- White
- CTE Linear ppm/°C
- 292 ppm / °C
- CTE Volumetric ppm/°C
- 876 ppm/°C
- Cure Profile
- 23+/-2°C and 50+/-5% humidity
- Cure Through to 3 mm Depth
- 7 hr
- Cure Type
- Acetoxy
- Density
- 1.07 g/cm3
- Dielectric Constant
- 3
- Dielectric Strength (V/mil)
- 457 V/mil
- Dielectric Strength kV/mm
- 18 kV/mm
- Dissipation Factor
- 0.0025
- Elongation at Break
- 270 %
- Extrusion Rate g/min
- 295 g/min
- Hardness Shore A
- 39
- Linear Shrinkage (%)
- 1 %
- Max Storage Temperature
- 40 °C
- Max Working Temp
- 300 °C
- Min Working Temp
- -50 °C
- Rheology
- Paste
- RTV or Heat cure
- RTV
- Self Bonding
- Yes
- Shelf Life
- 24 mths
- Tack Free Time / Skin Formation at 23°C/73°F
- 3 min
- Tear Resistance (N/mm)
- 6.1 N/mm
- Tensile Strength
- 2.4 N/mm2
- Test Conditions
- 7 days at 23+/-2°C and 50+/-5% humidity
- Thermal Conductivity
- 0.2 W/mK
- Volume Resistivity (Ohms cm)
- 3.21E+15 ohms cm
- Youngs Modulus (N/mm2)
- 0.75 N/mm2