Silicone Encapsulants for Thermal Management

With the continued miniaturization and expanding population of components that comprise electronic devices, mitigation of generated heat is an ongoing issue today. To achieve operational stability and longevity, thermally conductive materials are often incorporated within the device to aid in heat dissipation. With the addition of specialty fillers, CHT’s silicone formulations can be customized to facilitate the flow of heat to or from electronic components in an assembly

SILCOTHERM® thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink. They also provide protection from harsh environments, vibration and thermal shock. Addition cure silicones provide deep section cure allowing for complete encapsulation for environmental protection whilst maintaining an effective heat path.

General Attributes:

• Thermally conductive properties up to 3 W/Mk
• Range includes 1 and 2-part materials
• Includes UL approved products
• High temperature resistance up to 260ºC
• Range of vicosities and hardnesses

Applications:

Protection of components in:

• Electronics
• Avionics
• Automotive
• LEDs and lighting

For more information about thermally conductive silicones download our Thermal Transfer Application Sheet or our SILCOTHERM® brochure and product chart.