SILCOTHERM® thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink. They also provide protection from harsh environments, vibration and thermal shock. Addition cure silicones provide deep section cure allowing for complete encapsulation for environmental protection whilst maintaining an effective heat path.
With the continued miniaturization and expanding population of components that comprise electronic devices, mitigation of generated heat is an ongoing issue today. To achieve operational stability and longevity, thermally conductive materials are often incorporated within the device to aid in heat dissipation. With the addition of specialty fillers, CHT’s silicone formulations can be customized to facilitate the flow of heat to or from electronic components in an assembly.
Protection of components in:
SE 3000 is a very low viscosity thermally conductive encapsulant. Watch the video to see how easiliy it flows in and around your components for effective thermal transfer. This low viscosity silicone will also speed up your production times.
For more information about thermally conductive silicones download our Thermal Transfer Application brochure.
For technical assistance or sample requests, please visit our contact page.
|AS1420||1 Part Non-Corrosive Neutral Cure Adhesive Sealant and Potting Material (Electronic Grade)|
|AS1420-180||1 Part Non-Corrosive Neutral Cure Adhesive Sealant and Potting Material (Electronic Grade)|
|QSil 550||2 part encapsulation and potting silicone|
|QSil 550F||Addition Cure Potting Material|
|QSil 550LV||Addition Cure Potting Material|
|QSil 550LV AC||Addition Cure Potting Material|
|QSil 550SB||Self-Priming Silicone Potting Material|
|QSil 553||2-Part Encapsulation and Potting Silicone|
|QSil 553LV||2 part encapsulation and potting silicone|
|QSil 555||Addition Cure Potting Material|
|QSil 559||Addition Cure Potting Material|
|QSil 562||Addition Cure Potting Material|
|QSil 563||Addition Cure Potting Material|
|QSil 567||Addition Cure Potting Material|
|QSil 573||Addition Cure Potting Silicone|
|SE2003||2 part encapsulation and potting silicone|
|SE2010||2 part gap filler|
|SE3000||2 part encapsulation and potting silicone|
|Silcoset 101||2 part encapsulation and potting silicone|
|SilSo Cool 21311||2-part thermally conductive encapsulant|