World class silicones for worldwide solutions
SILCOTHERM® thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink. They also provide protection from harsh environments, vibration and thermal shock. Addition cure silicones provide deep section cure allowing for complete encapsulation for environmental protection whilst maintaining an effective heat path.
General Attributes:
- Thermally conductive properties up to 3 W/Mk
- Range includes 1 and 2-part materials
- Includes UL approved products
- High temperature resistance up to 260ºC
- Range of vicosities and hardnesses
Applications:
Protection of components in:
- Electronics
- Avionics
- Automotive
- LEDs and lighting
For more information about thermally conductive silicones download our Thermal Transfer Application Sheet or our SILCOTHERM® brochure and product chart.
Product Listing
| Code | Description | Request Sample | TDS | SDS |
|---|---|---|---|---|
| AS1406 | SILCOTHERM 1 Part flowable heat cured silicone adhesive sealant | |||
| AS1421 | SILCOTHERM 1 Part flowable heat cured 2.1 W/mK silicone adhesive | |||
| QSil553 | SILCOTHERM 2 Part Addition cure silicone encapsulant | |||
| QSil573 | SILCOTHERM 2 Part Addition cure silicone encapsulant | |||
| SE2003 | SILCOTHERM 2 Part Addition cure silicone encapsulant | |||
| SE3000 | SILCOTHERM 2 Part Addition cure low viscosity |