Silicone Encapsulation & Potting for Electronics

The practice of using silicone in encapsulating and potting electronic components is a well established process designed to protect delicate circuitry. This protection may be required for a number of reasons including, but not limited to: mechanical shock, thermal shock, vibration, chemical attack, humidity, extreme temperatures and wide thermal cycles. In addition to providing protection, the encapsulant may also be used to perform other functions, such as thermal transfer and/or light emission.

CHT supply a variety of silicone products:

• General use siicone encapsulants
• Optically clear silicone encapsulants
• Thermally conductive silicone encapsulants
• Silicone Gels
• PV junction box potting silicones

Although the end function may appear simple and straightforward the operating conditions, component design and production methods often place heavy demands on the encapsulant and require very meticulous product selection and testing. There are a variety of materials on offer including polyurethanes, epoxies, silicones and many other polymers - each system will have advantages as well as limitations. It is therefore, important to fully understand the chemical and physical properties of each system and carefully match these to the requirements of the component and manufacturing processes.

For more information, download our guide to Silicone Encapsulants.