Silicone Encapsulation & Potting for Electronics

Silicone potting compounds and encapsulants provide a flexible, protective barrier or enclosure against a variety of environmental factors for electronic circuits and systems. These silicones are used when a deep section cure is required and prevent, debris, heat shock and vibration from damaging the electronics.

In addition to protecting electronic components, silicone potting compounds and encapsulants are used for other functionalities that may be required such as thermal transfer and light emission.

CHT’s silicone technology reliably performs in these challenging conditions and contribute to the long-term operation of electronic devices.

CHT’s silicones range from optically clear to highly filled grades for thermal conductivity. CHT’s silicone potting compounds and encapsulants are formulated as either a condensation (tin) cure or addition (platinum) cure chemistry. One-part and two-part curing systems are available for each chemistry type. These silicones cure at room temperature, but if faster processing time is needed, heat will accelerate the cure process.

Key properties:

• Range of Hardnesses and viscosities:
• Wide operating temperature range: -55ºC to 300ºC
• Flame retardant, UL listed grades
• Optically clear and thermally conductive grades
• UV resistant, non-yellowing catalysts
• Good resistance to chemicals, water and humidity
• Adhesion to many substrates including glass, aluminium, and copper