World class silicones for worldwide solutions

SE2011


Downloads Request Sample
TDS
SDS
Description
2 part encapsulation and potting silicone
Feature
  • Adhesive at room temperature
  • Fast curing at room temperature
  • Low viscosity
  • UL recognised in file No. E334038
Code
SE2011
Feature
Feature 1
Adhesive at room temperature
Feature 2
Fast curing at room temperature
Feature 3
Low viscosity
Feature 4
UL recognised in file No. E334038
Color
Black
CTE Volumetric ppm/°C
837 ppm/°C
Cure Type
Condensation
De-mould Time / Full Cure at 23°C/73°F
2 hrs
Density
1.08 g/cm3
Density A
1.05
Density B
0.83
Dielectric Constant
3.28
Dielectric Strength kV/mm
23.4 kV/mm
Dissipation Factor
0.029
Elongation at Break
270 %
Hardness Shore A
23
Linear Coefficient of Thermal Expansion (ppm/°C)
279 ppm/°C
Linear Shrinkage (%)
2.8 %
Max Storage Temperature
40 °C
Max Working Temp
220 °C
Min Working Temp
-50 °C
Mix Ratio By Weight
10:1
Pot Life mins at 23°C/73°F
20 min mins
Rheology
Liquid
RTV or Heat cure
RTV
Self Bonding
Yes
Shelf Life
6 mths
Tensile Strength
0.9 N/mm2
Test Conditions
7 days at 23+/-2°C and 50+/-5% humidity
Thermal Conductivity
0.2 W/mK
UL File No.
E334038
Viscosity A
4400 cP
Viscosity B
100 cP
Viscosity Mixed
4000 cP
Volume Resistivity (Ohms cm)
1.09E+14 ohms cm
Back to top
X
Any questions, let us know!
Request more information
Request a sample