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AS1421-100

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Description
1 Part Non-Corrosive Neutral Cure Adhesive Sealant and Potting Material (Electronic Grade)
Feature
UL94V0 recognised in file No. E334038 Excellent thermal conductivity Fast heat cure and adhesion Contains 100 micron glass beads

Code: AS1421-100
Feature 1: UL94V0 recognised in file No. E334038
Feature 2: Excellent thermal conductivity
Feature 3: Fast heat cure and adhesion
Feature 4: Contains 100 micron glass beads
Appearance: Grey paste
Color: Grey
Cure Profile: 16 minutes at 100°C
Cure Type: Addition Heat Cure
Density: 2.18 g/cm3
Dielectric Strength (V/mil): >457 V/mil
Dielectric Strength kV/mm: >18 kV/mm
Elongation at Break: 105 %
Hardness Shore A: 56
Linear Coefficient of Thermal Expansion (ppm/°C): 195 ppm/°C
Max Storage Temperature: 10 °C
Max Working Temp: 210 °C
Min Storage Temperature: -5 °C
Min Working Temp: -50 °C
Rheology: Paste
RTV or Heat cure: Heat cure
Self Bonding: Yes
Shelf Life: 12 mths
Tensile Strength: 2.2 N/mm2
Test Conditions: After 60 minutes at 125°C
Thermal Conductivity: 2.1 W/mK
UL 94V-0: Yes
UL File No.: E334038
Viscosity: 140000 - 240000 cP
Volume Coefficient of Thermal Expansion (ppm/°C): 586 ppm/°C
Volume Resistivity (Ohms cm): 3.5E+13 ohms cm

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