- Code
- QSil 553 Feature
- Feature 1
- 100% solids - no solvents
- Feature 2
- Long pot life
- Feature 3
- Low modulus and good elongation
- Feature 4
- UL94 V0 listed in file No. E205830
- Color
- Gray
- Comparative Tracking Index (volts)
- 600 volts
- Cure Profile
- 15 mins at 150°C
- Cure Type
- Addition
- De-mould Time / Full Cure at 23°C/73°F
- 24 hr hrs
- Density A
- 1.63
- Density B
- 1.63
- Dielectric Constant
- 3.08
- Dielectric Strength (V/mil)
- 500 V/mil
- Dissipation Factor
- 0.009
- Elongation at Break
- 240 %
- Hardness Shore A
- 45
- Max Storage Temperature
- 38 °C
- Max Working Temp
- 240 °C
- Min Working Temp
- -55 °C
- Mix Ratio By Weight
- 1:1
- Pot Life mins at 23°C/73°F
- 100 mins
- Rheology
- Liquid
- Shelf Life
- 24 mths
- Tear Resistance (N/mm)
- 7.8 N/mm
- Tensile Strength
- 1.72 N/mm2
- Thermal Conductivity
- ~0.68 W/mK
- UL File No.
- E205830
- Viscosity Mixed
- 6000 cP
- Volume Resistivity (Ohms cm)
- 402000000000000 ohms cm