- Code
- QSil Beyond X1 Feature
- Feature 1
- Low linear shrinkage
- Feature 2
- Non-yellowing catalyst system
- Feature 3
- Self-bonding without primer, requires cure at elevated temperature to build adhesion and develop full physical properties
- Feature 4
- Meets Mil-I-81550C (type II) standard
- Color
- Transparent and Colorless
- Color A
- Transparent and colorless
- Color B
- Transparent and colorless
- Cure Profile
- 60 min at 150°C
- Cure Type
- Addition
- Dielectric Constant
- 2.69
- Dielectric Strength (V/mil)
- 500 V/mil
- Dissipation Factor
- 0.0006
- Elongation at Break
- 100 %
- Gel Time at 25°C/77°F
- >24 hr
- Hardness Shore A
- 45
- Linear Coefficient of Thermal Expansion (ppm/°C)
- 275 ppm/°C
- Linear Shrinkage (%)
- <0.1 %
- Max Storage Temperature
- 38 °C
- Max Working Temp
- 204 °C
- Min Working Temp
- -55 °C
- Mix Ratio By Weight
- 10:1
- Refractive Index at 589 nm
- 1.406
- Rheology
- Liquid, Newtonian
- Self Bonding
- Yes
- Shelf Life
- 12 mths
- Specific Gravity A
- 1.01
- Specific Gravity B
- 0.99
- Specific Heat (cal/g-°C)
- 0.3
- Tensile Strength
- 5.2 N/mm2
- Thermal Conductivity
- 0.18 W/mK
- Viscosity A
- 4,000 cP
- Viscosity B
- 650 cP
- Viscosity Mixed
- 3,400 cP
- Volume Resistivity (Ohms cm)
- 1.7E+15 ohms cm