World class silicones for worldwide solutions

QSil 553


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TDS
SDS
Description
2 part encapsulation and potting silicone
Feature
  • 100% solids - no solvents
  • Long pot life
  • Low modulus and good elongation
  • UL94 V0 listed in file No. E205830
Code
QSil 553
Feature
Feature 1
100% solids - no solvents
Feature 2
Long pot life
Feature 3
Low modulus and good elongation
Feature 4
UL94 V0 listed in file No. E205830
Color
Grey
Comparative Tracking Index (volts)
600 volts
Cure Profile
15 mins at 150°C
Cure Type
Addition
De-mould Time / Full Cure at 23°C/73°F
24 hr hrs
Density A
1.63
Density B
1.63
Dielectric Constant
3.08
Dissipation Factor
0.009
Elongation at Break
240 %
Hardness Shore A
45
Max Storage Temperature
38 °C
Max Working Temp
240 °C
Min Working Temp
-55 °C
Mix Ratio By Weight
1:1
Rheology
Liquid
Shelf Life
24 mths
Tear Resistance (N/mm)
7.8 N/mm
Tensile Strength
1.72 N/mm2
Thermal Conductivity
~0.68 W/mK
UL File No.
E205830
Viscosity Mixed
6000 cP
Volume Resistivity (Ohms cm)
402000000000000 ohms cm
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