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AS1745G


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SDS
Description
1 Part Non-Corrosive Neutral Cure Adhesive Sealant (Electronic Grade)
Feature
  • MIL 46146B physical / chemical requirements
  • High mechanical strength
  • High temperature resistance
  • Non slumping adhesive paste
Code
AS1745G
Feature
Feature 1
MIL 46146B physical / chemical requirements
Feature 2
High mechanical strength
Feature 3
High temperature resistance
Feature 4
Non slumping adhesive paste
Appearance
Thixotropic paste
Colour
Grey
Cure Through to 3 mm Depth
72 hr
Cure Type
Alkoxy
Density
1.16 g/cm3
Dielectric Constant
2.47
Dielectric Strength (V/mil)
457 V/mil
Dielectric Strength kV/mm
18 kV/mm
Dissipation Factor
0.0035
Drying / Fixing Conditions
23+/-2°C and 50+/-5% humidity
Elongation at Break (%)
830 %
Hardness Shore A
35
Lap Shear Aluminium kg/cm²
8.78 kg/cm²
Linear Coefficient of Thermal Expansion (ppm/°C)
267 ppm/°C
Max Storage Temperature
40 °C
Max Working Temp (°C)
316 °C
Min Working Temp (°C)
-62 °C
Rheology
Paste
RTV or Heat cure
RTV
Self Bonding
Yes
Shelf Life (mths)
12
Slump
1 mm/5mins
Tack Free Time / Skin Formation at 23°C/73°F
45 min
Tear Resistance (N/mm)
42 N/mm
Tensile Strength (N/mm2)
7.75 N/mm2
Test Conditions
7 days at 23+/-2°C and 50+/-5% humidity
Thermal Conductivity (W/mK)
0.2 W/mK
Volume Coefficient of Thermal Expansion (ppm/°C)
800 ppm/°C
Volume Resistivity (Ohms cm)
8.8E+14 ohms cm
Youngs Modulus (N/mm2)
0.63 N/mm2
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