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QSil 58


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TDS
SDS
Description
Condensation cure potting material
Feature
  • Excellent thermal stability
  • Self-levelling
  • Variable cure speed
  • Useful temper range of -54ºC (-65ºF) - 260ºC (500ºF) continuously and up to 316ºC (600ºF) intermittently
Code
QSil 58
Feature
Feature 1
Excellent thermal stability
Feature 2
Self-levelling
Feature 3
Variable cure speed
Feature 4
Useful temper range of -54ºC (-65ºF) - 260ºC (500ºF) continuously and up to 316ºC (600ºF) intermittently
Color
Red
Cure Profile
24 hrs at 25°C
Cure Type
Condensation
Dielectric Constant
~4.4
Dielectric Strength (V/mil)
450 V/mil
Dielectric Strength kV/mm
13.9 kV/mm
Dissipation Factor
0.03
Gel Time at 25°C/77°F
49 min
Gel Time at 25°C/77°F
50 minutes
Hardness Shore A
58
Max Storage Temperature
4.4 °C
Max Working Temp
260 °C
Min Working Temp
-54 °C
Mix Ratio By Weight
100:0.5 or 10:1
Rheology
Liquid
RTV or Heat cure
RTV
Shelf Life
12 mths
Specific Gravity
1.48
Test Conditions
24 hours at 25°C
Thermal Conductivity
0.31 W/mK
Viscosity
9,000 cP
Volume Resistivity (Ohms cm)
2E+14 ohms cm
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